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INTRODUCTION
OUR HISTORY
OUR TREND
ROBOT SOLDERING HISTORY
PATENT TECHNOLOGY
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PATENT TECHNOLOGY
Home > Company >
Patent Technology
Only Our technology for Selective soldering
does not allow
overtaking by other companies.
1.
Selective Sludge Reduction technology
A device that keeps and supplies nitrogen inside the solder pot, It can reduce sludge in the POT
Patent Application No. 10-2021-0031560 (DAS Access Code 4627)
2.
Nitrogen smoothing supply
A device that keeps the nitrogen in the pot and reduce the usage of nitrogen
Patent Application No. 10-2021-0031561 (DAS Access Code 6C92)
3 .
Auto Nozzle Cleaning
The cleaning solution is automatically supplied, and the nozzle is cleaned automatically at the set intervals
Patent Application No. 10-2021-0031561
4 .
Impeller one touch connection type
Impeller One-touch disassembly and assembly type
Head Office: 36, Bucheon-ro 198beon-gil, Wonmi-gu, Bucheon-si, Gyeonggi-do, Republic of Korea
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